1. in-line package: a package bracket as the main material, one end is a spherical structure placed beads, the other end is inserted in the pin for mold. The plug - in packaging device is mainly used for outdoor display products with a distance of more than 8mm, with the advantages of high brightness and easy to achieve waterproof and dustproof. But the shortcomings are also obvious, it is difficult to achieve high density display.
2. point package: LED chip is made up of matrix, welded on a PCB board, forming module, and then connected to external devices. The advantages are good flatness, high reliability and excellent protection level. The disadvantage is that the production process is slightly complex and the quality of the material is higher. It can be used for outdoor display and indoor display screens, which are generally used for display screens with a density greater than P3.
3. surface mount package: the most important feature is high degree of automation, which can be directly applied to SMT high-speed mounter. It has more advantages in the high-density display production process, so it is mainly used for high-density indoor display. The advantage is that the color consistency is good, but it needs to be strengthened in the protection level. Small pitch LED display screen is mainly used in the indoor field generally uses surface mount packages, because the number of beads will need processing with the spacing reduced exponentially, surface mount package can be used for automatic production of high-speed smt. With LED display pixel spacing is reduced, the unit area amount increasing, the cost of the whole lamp in the screen, accounted for the rise. According to our estimates, in the small pitch LED display P1.9 and smaller spacing between the types of products, lamp cost share has reached more than 70%. It is worth noting that the different levels of the components of the price gap is large, up to double or even several times, so different companies of the same size screen, often costs and prices are different, such as small pitch LED display lianchengfa P2.5 specifications, using imported bulbs and drive IC high end components of the product, 2 times the price per square meter can reach the same specifications of products using low-end components. At present, the core components of LED display technology, the highest content of chip and package of the high-end market is still occupied by foreign manufacturers, the main market of low-end products to Chinese enterprises; technical barriers to drive IC and PCB slightly lower SheetMaterials degree is higher. We believe that the mainland LED display industry chain enterprises are catching up with foreign leaders from two aspects of scale and technological progress. With the rapid rise of the LED display industry chain in mainland China, the localization of various components is more and more high. With the improvement of technology and capacity of domestic packaging enterprises, the localization of LED display devices will be promoted in the next few years, which will effectively drive smaller space, reduce products cost and enter the market, instead of traditional indoor display technology. With the rapid expansion of market cake, overseas packaging leader is also expected to enter the field, forming healthy competition of packaging device market, promoting technological progress and cost reduction.